The IEI TANK-XM813 Edge AI Embedded System is designed to support the latest Intel® Core™ Ultra platform, offering exceptional computing performance and energy efficiency at the industrial edge. It features flexible processor configurations with built-in Intel® AI Boost (NPU) for intelligent workload acceleration, along with expandable GPU capability and high-speed PCIe Gen 4 NVMe storage. The scalable and modular architecture provides reliable performance and simplified integration for diverse edge applications, including machine vision, transportation, medical imaging, and factory automation.
Supports Intel® Core™
Ultra 9/7/5 Processors
Built-in NPU for AI
Acceleration
High-Speed DDR5
(5600 MHz, 96 GB)
Supports Full-Length
3-Slot GPU Cards
Dual 2.5G LAN by Intel® I226 Series
Wide Operating Temp
(-20°C ~ 60°C)
The IEI TANK-XM813 supports a wide range of Intel® Core™ Ultra processors (Series 2), providing scalable computing performance for various edge workloads. Built on the latest Intel® architecture with integrated AI Boost (NPU) and Intel® Arc™ graphics, the platform delivers efficient AI acceleration, enhanced multitasking capability, and 4K graphics output in a compact industrial form factor. This flexibility allows system builders to tailor CPU configurations to meet performance, thermal, and power requirements in demanding edge environments. * Intel® Arc™ graphics are available only on specific Intel® Core™ Ultra processor SKUs.
While most embedded systems are locked in fixed configurations, the TANK-XM813 is built on a three-layer modular structure that simplifies installation, customization, and maintenance. With optional 2-, 4-, or 6-slot backplanes and 8-port PoE or dual-M.2 expansion modules, it adapts to new interfaces or AI workloads without redesigning the entire system—saving integration cost and lead time for OEMs.
The TANK-XM813 series of embedded computers from IEI provides great scalability and flexibility, thanks to its unique eChassis modules. This makes it easy for system integrators to configure a system that meets specific user requirements.
Choose an ideal embedded system according to CPU and price
Choose a backplane according to functionality
Find a corresponding chassis according to the selected backplane
Find a sufficient power supply
The TANK-XM813 supports scalable GPU expansion through the TXC-XM81-G1 and TXC-XM81-G2 eChassis, enabling up to 380 W of additional power in a full-length, full-height form factor. This modular GPU expansion architecture allows seamless integration of high-performance AI accelerators, frame grabber cards, and data-acquisition boards for real-time inference and vision analysis at the edge.
For performance upgradability and flexibility, the TANK-XM813 supports eChassis and eBP modules to add edge inference capabilities. It also provides up to 7 system configuration options. Users can select a specific package that provides extra PCIe expansion slots for add-on cards such as frame grabber cards, accelerator cards, I/O cards, motion control cards, and even GPU accelerators for machine learning and AI workloads.
Selection Guide
A TXC-XM81-3S | B TXC-XM81-3S | C TXC-XM81-4S | D TXC-XM81-4S | E TXC-XM81-4S | F TXC-XM81-G1 | G TXC-XM81-G2 | |
|---|---|---|---|---|---|---|---|
| eChassis | TXC-XM81-3S | TXC-XM81-3S | TXC-XM81-4S | TXC-XM81-4S | TXC-XM81-4S | TXC-XM81-G1 | TXC-XM81-G2 |
| eBP | TXCBP-XM81-2A | TXCBP-XM81-2B | TXCBP-XM81-4A | TXCBP-XM81-4B | TXCBP-XM81-4C | TXCBP-XM81-4A | TXCBP-XM81-G2 |
| Slot 1 | PCIe x16 | PCIe x16 (x8 signal) | PCIe x16 | PCIe x16 (x8 signal) | PCIe x16 | PCIe x16 | PCIe x16 (x8 signal) |
| Slot 2 | - | - | PCIe x1 | PCIe x4 | PCIe x4 | PCIe x1 | - |
| Slot 3 | PCIe x4 | PCIe x16 (x8 signal) | PCIe x4 | PCIe x16 (x8 signal) | PCI | PCIe x4 | PCIe x16 (x8 signal) |
| Slot 4 | - | - | PCIe x4 | PCIe x4 | PCI | - | - |
| Slot 5 | - | - | - | - | - | - | PCIe x4 |
| Slot 6 | - | - | - | - | - | - | PCIe x4 |
The TANK-XM813 adopts a dual-power input architecture to deliver stable and efficient power for both the host system and high-performance add-on cards. By integrating the IEI IDD-X1228I50-R10 power board, the system provides independent 12 V or 16–28 V DC power to GPU cards and AI accelerators requiring more than 75 W.
Ruggedized hardware architecture safeguards the small factor computer in harsh, remote and dynamic environments.
The TANK-XM813 features an enhanced fanless thermal architecture built with an extruded aluminum chassis and a multi-layer heat-spreader structure that optimizes heat conduction from the Intel® Core™ Ultra processor to the chassis surface. This design improves two-dimensional heat transfer and reduces airflow impedance, ensuring stable and silent operation in demanding industrial environments. Its lighter and slimmer housing enhances mechanical rigidity and vibration resistance, making it ideal for AGV, AMR, and factory automation applications. An optional external fan kit can be installed to strengthen airflow and maintain maximum CPU or GPU performance in high-temperature or AI-intensive workloads.
For applications that demand continuous high computing or AI inference performance, users can install the optional external fan kit for active cooling. It helps maintain peak performance in elevated temperature conditions and under heavy CPU/GPU loads. The modular design ensures dust-free operation, is easy to detach and clean, and delivers long-term reliability for field-deployed systems.
The TANK-XM813 supports multiple mounting options, including wall, side, and desktop installation, enabling quick and flexible deployment across diverse edge AI and industrial applications. Its slimmer and lighter chassis design simplifies integration in control cabinets, production lines, or field environments where space is limited. Whether installed on a wall, within an equipment cabinet, or placed on a desktop, the TANK-XM813 ensures easy maintenance and reliable operation in every scenario.
Using the two side wings
Space-saving side mounting in a cabinet
Easy for field maintenance
The TANK-XM813 adopts a reinforced three-layer mechanical design that keeps the mainboard securely mounted and prevents bending or warping during assembly. Both the top and bottom covers can be easily opened for quick installation of the CPU, DDR5 memory, and dual 2.5" storage drives. Its slimmer chassis simplifies field integration and maintenance, while system integrators can take advantage of local configure-to-order service (CTOS) for efficient customization and deployment.
The TANK-XM813 provides seamless wireless connectivity for both remote and mobile edge AI deployments. Through the M.2 A Key slot, users can integrate Wi-Fi 6 and Bluetooth 5.2 modules for reliable short-range communication with sensors and controllers. Dual SIM sockets support continuous LTE or 5G cellular connections, ensuring network redundancy and uninterrupted data transmission in outdoor or mobile environments. With its flexible wireless expansion design, the TANK-XM813 offers high-speed connectivity and easy integration for a wide range of industrial and AI applications.
The TANK-XM813 supports an optional 2.5 GbE PoE+ (IEEE 802.3at) module that provides up to eight Ethernet ports, each capable of delivering 30 W per port for simultaneous data and power transmission. This allows the system to directly connect and power networked devices—such as cameras, sensors, or controllers—without additional adapters or external power sources. IEI’s GPOE-XM81-8P Ethernet daughterboard can be seamlessly integrated into the TANK-XM813 through standard PCI Express interfaces, offering additional Ethernet I/O ports and scalable connectivity for industrial IoT and AI deployments.
IEI PoE LAN Module P/N: GPOE-XM81-8P
The TANK-XM813 integrates Intel® Arc Graphics from the Core Ultra processor to deliver vivid 4K visuals and smooth playback.
It supports DisplayPort 1.4, HDMI™ 1.4, and USB4 (Display + Data) interfaces, enabling flexible dual- or triple-display configurations for edge AI visualization and control dashboards.
The system offers plug-and-play operation with no additional drivers required, handling both video and audio transmission seamlessly.
The TANK-XM813 integrates a high-speed PCIe Gen 4 ×4 M.2 2280 slot, enabling NVMe SSD performance up to 64 Gb/s — twice the bandwidth of PCIe Gen 3.
Compared with traditional SATA SSD (6 Gb/s), this design drastically accelerates data access and write speeds, reducing latency for time-critical edge workloads.
Such performance makes the system ideal for AI inference, machine vision, data logging, and industrial automation tasks that demand real-time throughput and reliability.
| Form factor | |
|---|---|
| SBC Form Factor |
|
| I/O Interface | |
| I/O Ports |
|
| Expansion Slots | |
| Expansion Slots |
|
| System | |
| Cooling method / System Fan |
Fanless 4-pin external system fan connector |
| Drive Bays | 2 x 2.5” SATA 6Gb/s HDD/SSD bay (RAID 0/1 supported) |
| Indicator&Buttons | |
| Buttons |
1 x Power button 1 x Reset button 1 x AT/ATX switch |
| Indicators |
1 x Power LED (Red) 1 x HDD LED (Green) |
| Physical Characteristics | |
| Construction | Extruded aluminum alloy |
| Color | |
| Color | Black |
| Dimensions | |
| Dimensions | 230.6 x 255 x 68.7 |
| Weight | |
| Weight | 3.2/3.6 kg |
| Environment | |
| Operating Temperature |
-20°C ~ 60°C (CPU TDP35W & SSD) -20°C ~ 50°C (CPU TDP65W & SSD) |
| Humidity | 10% ~ 95% non-condensing |
| Operating Vibration | Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD) |
| Operating Shock | MIL-STD-810G 514.6C-1 (SSD) |
| Safety & EMC | CE/FCC compliant |
| OS Support | |
| OS Support | Microsoft Windows 10 / Windows 11, Linux |
| TANK-XM813-U9BD-R10 | Ruggedized Fanless Embedded System With Intel® Ultra 9 285 2.5GHz (up to 5.6 GHz, 24-core, TDP 65W), 16GB RAM,1xHDMI,1xDP++, USB4, 12~28V DC and RoHS |
|---|---|
| TANK-XM813-U9AD-R10 | Ruggedized Fanless Embedded System With Intel® Ultra 9 285T 1.4GHz (up to 5.4 GHz, 24-core, TDP 35W), 16GB RAM,1xHDMI,1xDP++, USB4, 12~28V DC and RoHS |
| TANK-XM813-U7BD-R10 | Ruggedized Fanless Embedded System With Intel® Ultra 7 265 2.4GHz (up to 5.3 GHz, 20-core, TDP 65W), 16GB RAM,1xHDMI,1xDP++, USB4, 12~28V DC and RoHS |
| TANK-XM813-U7AD-R10 | Ruggedized Fanless Embedded System With Intel® Ultra 7 265T 1.5GHz (up to 5.3 GHz, 20-core, TDP 35W), 16GB RAM,1xHDMI,1xDP++, USB4, 12~28V DC and RoHS |
| TANK-XM813-U5BD-R10 | Ruggedized Fanless Embedded System With Intel® Ultra 5 225 3.4GHz (up to 4.9GHz, 10-core, TDP 65W), 16GB RAM,1xHDMI,1xDP++, USB4, 12~28V DC and RoHS |
| TANK-XM813-U5AD-R10 | Ruggedized Fanless Embedded System With Intel® Ultra 5 225T 2.5GHz (up to 4.9GHz, 10-core, TDP 35W), 16GB RAM,1xHDMI,1xDP++, USB4, 12~28V DC and RoHS |
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