» 2U AI Modular PC with 8th/9th Generation LGA 1151 Intel® Core™ i7/i5/i3 and Pentium® processor
» Four hot-swappable and accessible HDD drive bays, support RAID 0/1/5/10
» Two PCIe 3.0 by 4 and two PCIe 3.0 by 8 slots
» Dual M.2 2280 PCIe Gen 3.0 x4 NVMe™ SSD support
» QTS-Gateway support
» Modular LCD panel kit design. Please refer FLEX-PLKIT Selection
Hardware Spec.
| Form factor | |
|---|---|
| SBC Form Factor |
8th/9th Genertion Intel CoreTM i7/i5/i3 porcessors in the LGA 1151 Intel® 300 Series Chipsets Q370 FLEX AI Modular Box PC |
| I/O Interface | |
| I/O Ports |
1 x HDMI™ output 2 x GbE LAN 6 x USB 3.0 Type-A 2 x RS-232 DB-9 type 1 x Mic in 1 x Line out 1 x AC power in Inlet |
| Expansion Slots | |
| Expansion Slots |
2 x PCIe 3.0 by 8 (by 16 slot) 2 x PCIe 3.0 by 4 (maximum card size supported: 68 mm x 167 mm) |
| System | |
| Cooling method / System Fan | System fan |
| Drive Bays | 4 x Accessible 2.5” SATA 6Gb/s HDD/SSD bay (RAID 0/1/5/10 support) |
| Indicator&Buttons | |
| Buttons |
Power button with power LED (power on=Blue) AT/ATX mode switch Reset button |
| Color | |
| Color | Black C |
| Dimensions | |
| Dimensions | 357 x 230 x 88 |
| Weight | |
| Weight | 4kg |
| Environment | |
| Operating Temperature |
-20°C ~ 50°C (with SSD and TDP 65W processor) -20°C ~ 40°C (with HDD or add-on cards without fan) |
| Humidity | 5% ~95%, non-condensing |
Ordering Information
| FLEX-BX200-Q370-i3/25-R10 | 2U AI Modular BOX PC, Intel® Core™ i3-8100T Processor (4-core, 4-thread, 3.10 GHz) TDP 35W, 2xPCIex4 and 2xPCIex8 slots, 4x HDD bay, 250W PSU, R10 |
|---|---|
| FLEX-BX200-Q370-P/25-R10 | 2U AI Modular BOX PC, Intel® Penturm® Gold G5400T Processor (2-core, 4-thread, 3.10 GHz) TDP 35W, 2xPCIex4 and 2xPCIex8 slots, 4x HDD bay, 250W PSU, R10 |
Package Contents
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Marketing Material
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Brochure
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Brochure
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