IEI Launches DDR5-Ready Industrial Solutions Targeting Scalable Edge Computing
Aug 29, 2025
With edge workloads becoming more data-intensive and time-sensitive, edge computing systems must process larger datasets at faster speeds, often in harsh industrial environment.
To address these evolving demands, IEI introduces its new generation of industrial motherboards supporting DDR5 memory, designed to deliver the performance, efficiency, and scalability required for AI-driven and data-heavy edge computing applications.
Available in a full range of form factors—from full-sized ATX to compact 2.5” SBCs—this versatile motherboards enables flexible system designs across diverse industrial scenarios.
The series supports a wide range of next-generation processors—including Intel® Core™ Ultra, Intel® Core™, Intel® Atom®, and AMD Ryzen™ 7000/8000G/9000 as well as EPYC™ 8004—offering scalable performance options optimized for diverse edge AI and industrial automation workloads.
Key benefits of the DDR5-ready motherboard lineup include:
| Platform | Form Factor | Part Number | |
|---|---|---|---|
| Intel Platform | ATX Motherboard | IMBA-R680, IMBA-ARL-W880, IMBA-ARL-H810, IMBA-ARL-Q870 | |
| Micro-ATX Motherboard | IMB-MTL, IMB-ARL-Q870, IMB-ARL-H810 | ||
| Mini-ITX Motherboard | KINO-ADL-N, KINO-ARL-H810 | ||
| PICMG 1.3 CPU card | Full Size | PCIE-RPL-Q670 | |
| Half Size | HPCIE-RPL-Q670 | ||
| 3.5” SBC | WAFER-ADL-N, WAFER-ASL | ||
| 2.5” SBC | HYPER-ASL | ||
| AMD Platform | ATX Motherboard | IMBAX-SP6, IMBA-AM5 | |
| Micro-ATX Motherboard | IMB-AM5, IMB-V3000 | ||
| Mini-ITX Motherboard | KINO-AM5, KINO-MPHX | ||
| PICMG 1.3 CPU card | Full Size | PCIE-AM5 | |
From boards to systems: Scalable solutions for real-world edge deployments
To complement the new DDR5-ready motherboards, IEI also offers a fanless box PC, TANK-XM813 and an IP66-rated stainless steel panel PC, Shield Series —ideal for edge AI deployment and hygienic industrial environments. These ready-to-deploy systems complete a robust edge computing portfolio for diverse automation needs.
Product Highlights
Expandable Box PC
TANK-8700Fanless, modular, and powered by AMD Ryzen™ 7000/8000 Mobile Processors, supporting 3-slot expansion for demanding edge AI workloads.
Learn MoreExpandable Box PC
TANK-XM813Fanless, modular, and powered by Intel® Core™ Ultra Processors, supporting multiple expansion options for demanding edge AI workloads.
Coming SoonDIN-rail PC
DRPC-243 Fanless DIN-rail PC powered by Intel® Core™ Ultra processors, designed for reliability in harsh conditions, offering versatile I/O connectivity
Coming SoonRugged Panel PC
Shield Series 15.6–21.5″ stainless steel widescreen panel PC with Intel Atom® x7433RE/x7835RE, IP66 full-body waterproofing, and M12 I/O for hygienic, harsh environments.
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