3.5 SBC supports Intel® Alder Lake-N/Amston Lake on-board SoC, triple display with DP, HDMI™ and iDPM slot, dual 2.5 GbE, USB 3.2 gen 2, M.2, SATA 6Gb/s, COM and RoHS, -10°C ~ 60°C

  • WAFER-ADL-N Front
  • WAFER-ADL-N Back
  • WAFER-ADL-N Left
» Support 12th/13th Intel® Alder Lake-N/Amston Lake on board SoC
» Support on-board LPDDR5x 8GB memory, up to 16GB
» Support triple independent display via HDMI™, DP and iDPM slot
» Support PCIe x4 (x2 signal), M.2 M key and M.2 A key expansion
» Support two 2.5GbE LAN with I225V/I226V


Quad-Core Intel® Processror N Series

The WAFER-ADL-N Series is powered by the 12th Gen Intel® Processor N Series. They provide 42% improved performance and consume less power, making them ideal for demanding tasks while conserving energy. These processors offer robust computing for various purposes, including media editing and running complex software. They are well-suited for gaming, data processing, and artificial intelligence industries. Their high performance and energy efficiency make them an excellent option for powerful computing across diverse applications.

Triple Independent Displays with up to 4K Resolution

The WAFER-ADL-N has Intel® UHD Graphics and can handle three separate displays. It is great for many IoT uses that need multiple screens. Whether you want to show information on different displays or use many screens at once, its powerful graphics make integrating everything easy. It is also triple display feature is ideal for IoT applications needing to manage multiple screens efficiently.

PCIe x4 Slot Allows Extensive I/O and Function Expansion

Outwards-facing Expansions

Inwards-facing Expansions

PCIe x4 Interface Card Expansion

Outwards-facing Expansions:
Two PCIe x1 / One PCIe x2

The outwards-facing riser card, NWR-L2S, enables the connection of up to two outwards-facing PCIe x1 slots via one PCI Express interface. Although may take up more space, it can help enhance the airflow and heat transfer within the system. It is ideal for the chassis that is wide enough for the expansion card to be placed.

Inwards-facing Expansions:
Two PCIe x1 / One PCIe x2

The inwards-facing riser card, NWR-R2S, enables the connection of up to two inwards-facing PCIe x1 slots via one PCI Express interface. It is suitable for installation where space is limited. With higher height to increase spacing between boards, it can ensure efficient heat dissipation for space-constrained applications.

PCIe x4 Interface Card Expansion

The PCIe Gen3 x4 (x2 signal) slot, providing high-speed data transfer rate of up to 2GB/s, allows for additional customization and expansion. Directly installing a PCIe card enables the motherboard to run more complex and challenging tasks at the edge.

IEI Heat Conduction Casing (IHCC)

Thermal Solution

Diverse Mounting

Fitting Different
Mounting Needs

IEI has developed a highly efficient thermal solution for the 3.5" SBC - the IEI Heat Conduction Casing (IHCC). The IHCC effectively enhances heat transfer performance by targeting the primary heat source, thus eliminating the need for designing a separate heat spreader.
The IHCC consists of a casing and a heat conduction block that securely fits over the key components where the major heat is generated, ensuring optimal heat transfer.

Diverse Mounting Options

With its well-design thermal casing, the WAFER-ADL-N provides 13 holes on three sides. It can be conveniently mounted on the back panel, door, or DIN rail of a control cabinet. Moreover, installing an extra thermal module for optimal performance in elevated ambient temperatures is a straightforward process.

Fitting Different Mounting Needs

The motherboard is designed to cater to various mounting requirements, such as in embedded system/electrical cabinet, or versatile stacking with thermal modules.

Elevate Your Performance with DDR5 Memory Technology

The WAFER-ADL-N delivers unmatched performance with DDR5 memory, which offers more storage, lower power, and DDR4 compatibility. This cutting-edge solution unlocks limitless possibilities, revolutionizing your computing experience with a bandwidth supporting up to 4800Hz, 50% higher than the previous generation's 3200Hz.

Increased Speed and Bandwidth

DDR5 offers significantly higher data transfer rates compared to DDR4, resulting in faster and more efficient performance. It's great for gaming, content creation, and scientific simulations.

Lower Power Consumption

DDR5 operates at lower voltages, resulting in reduced power consumption. This not only helps in conserving energy but also generates less heat, contributing to better system stability and cooler operation.

Higher Memory Capacity

DDR5 supports higher memory capacities, allowing for larger amounts of data to be stored and accessed. This is particularly beneficial for applications that require extensive memory usage, such as gaming, video editing, and data-intensive tasks.

Enhanced Error Correction

DDR5 incorporates advanced error correction capabilities, enhancing data integrity and reliability. This helps in minimizing data corruption and improving system stability, especially when dealing with large amounts of data.

M.2 Expansion for Wi-Fi and NVMe Storage

M.2 2230 A Key for Wi-Fi/Bluetooth

The M.2 2230 A key slot carrying with PCIe Gen3 x1 and USB 2.0 signals allows it to adopt the latest Wi-Fi 6E technology. Wi-Fi 6E enhances low latency and supports service levels that are equivalent to 5G networks.

M.2 2280 M Key for NVMe SSD

The M.2 2242/80 M Key slot for PCIe offers advantages including high-speed data transfer, increased storage capacity, compact size, improved system performance, and compatibility with the efficient NVMe protocol.

Dual Low-Latency 2.5G LAN Powered by Intel

2.5 GbE allows for different connection speeds ranging from 100 Mbps to 2.5 Gbps on Cat 6 and Cat 5e cables, enabling users to fully utilize high-performance network solutions without costly cable upgrades.



SBC with
Riser Card (NWR-R2S)

SBC with
Riser Card (NWR-L2S)

SBC with Outwards-facing Riser Card
SBC with Outwards-facing Riser Card (R4S)

Hardware Spec.

Form Factor
Form Factor 3.5” SBC
CPU Intel® Alder Lake-N N97 SoC Processor
Intel® Alder Lake-N N200 SoC Processor
Memory Dual channal LPDDR5x 8G pre-installed (system max. 16G)
Memory Max. 16GB
Physical Characteristics
Dimensions (LxWxH) (mm) 146mm x 102mm
Net Weight 350g
Storage 1 x SATA : 6Gb/s
1 x M.2(NGFF) : 1 x M.2 M Key 2280 (PCIe Gen3 x1)
I/O Interface
Display Output 1 x HDMI™ : up to 4096 x 2160 @ 30Hz
1 x Display Port : up to 4096 x 2160 @ 60Hz
1 x iDPM (only for IEI eDP/LVDS/VGA module)
Ethernet 2 x LAN -
LAN1: Intel® I225V/I226V 2.5GbE controller
LAN2: Intel® I225V/I226V 2.5GbE controller
Audio 1 x HD Audio : 1 x iAUDIO, support IEI AC-KIT-888S Audio Module (2x5 pin)
I/O Interface 2 x Internal RS-232/422/485 (1x9 pin, P=1.25)
2 x External USB 2.0 (Type A)
2 x Internal USB 2.0 (2x4 pin, P=2.0)
2 x External USB 3.2 Gen2x1 (10Gb/s, Type A)
Expansion 1 x PCIe x4 : PCIe Gen3 x2 signal
2 x M.2(NGFF) -
1 x M.2 A Key 2230 for WIFI & BT (PCIe Gen3 x 1 & USB 2.0)
1 x M.2 M Key 2280 (PCIe Gen3 x1)
Power Consumption 12V@3.21A
(Intel® Processor N97 with 8 GB 4800 MHz LPDDR5 memory, max. loading, EuP mode disabled)
(Intel® Processor N200 with 8 GB 4800 MHz LPDDR5 memory, max. loading, EuP mode disabled)
Power Supply ATX/AT power supply
Support AT/ATX mode
ErP/EuP Compliant
Operating Temperature -10°C ~ 60°C
Storage Temperature -20°C~70°C
Humidity 5% ~95%, non-condensing

Ordering Information

WAFER-ADL-N97C-R10 3.5 SBC supports Intel® Processor N-series N97 SoC Processor,with 8GB LPDDR5x memory on board default, with DP ,HDMI™ iDPM ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS
WAFER-ADL-N200C-R10 3.5 SBC supports Intel® Processor N-series N200 SoC Processor,with 8GB LPDDR5x memory on board default, with DP ,HDMI™ iDPM ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS

Package Contents

Package Content
  • 1 x WAFER-ADL-N SBC with heat spreader

  • 1 x SATA with power cable kit

  • 1 x QIG