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tKINO-ULT6
» Thin Mini-ITX form factor with Intel® Tigerlake-UP3 processor support DDR4-3200 memory
» Wide range 9~36V DC Input
» Support quadruple independent displays (HDMI, DP, eDP/LVDS, Type-C DP)
» Dual Intel® GbE LAN with Intel® AMT 11.0 supported
» M.2 A key for WIFI+Bluetooth (PCIe x1/USB 2.0), M.2 M key for Storage (PCIe x2/SATA)
» PCIe x8 slot (x4 signal)
Breaking the Boundaries of Performance
The Best Thin Mini-ITX Bring Industry-leading, Graphics and AI performance
Thin Mini-ITX form factor with 11th Gen. Intel® Core™ Processor Family (Tiger Lake-UP3) 11th Generation Intel® Core™ mobile processors with Iris Xe graphics quidem veritatis cum delectus earum et? Hic sit cupiditate quo totam autem molestiae voluptate explicabo soluta minima impedit.
11th Gen Tiger Lake-UP3 CPU & Graphic Performance
Tiger Lake is Intel's codename for the 11th generation Intel Core mobile processors based on the new Willow Cove Core microarchitecture, manufactured using Intel's third-generation 10 nm process node known as 10SF ("10 nm SuperFin"). Tiger Lake replaces the Ice Lake family of mobile processors, representing an Optimization step in Intel's process–architecture–optimization model. Tiger Lake processors launched in 2020 are part of the Tiger Lake U family and include dual-core and quad-core 9 W (7-15 W) TDP and 15 W (12-28 W) TDP models.
V.S 2019 Whiskey Lake U processor:
- offer ~22% better single threaded ~ 32% better multi-threaded.
- 3D performance : 3.5x times better performance over Whiskey Lake U processor.
V.S 2017 Kaby Lake U processor:
- offer ~41% better single threaded ~ 95% better multi-threaded.
- 3D performance : 3.1x times better performance over Kaby Lake U processor.
USB4 higher transfer speeds, improved bandwidth & backward compatibility
Two-lane operation with up to 40 Gbps operation using the USB Type-C connection
More efficient sharing between data and display protocols
Backward compatibility with USB 3.2, USB 3.1, USB 3.0, USB 2.0, and even Thunderbolt 3.
2.5GbE LAN
2.5 times faster
2.5GbE is 2.5 times faster than standard Ethernet (1GbE), increasing network performance to boost productivity. Works with existing cables
Works with existing cables
No special cables or connectors are required to take advantage of 2.5GbE. Simply use your existing CAT5e cables as normal with your new 2.5GbE infrastructure.
More affordable
If you can’t budget a 10GbE upgrade at this time, the more affordable 2.5GbE provides a notable improvement in current Ethernet speeds.
Application Fields
Digital Signage
Smart Retail Store
Surveillance
I/O Interface
Dimensions
Hardware Spec.
| Form Factor | |
|---|---|
| Form Factor | Mini-ITX Motherboard |
| System | |
| CPU |
11th Gen. Intel® mobile Tiger Lake-UP3 on-board processor Intel® Core™ i7-1185G7E (up to 4.4GHz, quad-core, 12M Cache, TDP=28/15/12W) Intel® Core™ i5-1145G7E (up to 4.1GHz, quad-core, 8M Cache, TDP=28/15/12W) Intel® Core™ i3-1115G4E (up to 3.9GHz, dual-core, 6M Cache, TDP=28/15/12W) Intel® Celeron® 6305E (up to 1.8GHz, dual-core, 4M Cache, TDP=15W) |
| Memory | 2 x SO-DIMM DDR4 3200MHz, system maximun up to 64GB |
| Memory Max. | Up to 64GB |
| Cooling method / System Fan | 1 x CPU Cooler |
| Physical Characteristics | |
| Dimensions (LxWxH) (mm) | 170mm x 170mm |
| Net Weight | GW:900g / NW:400g |
| Storage | |
| Storage | 2 x SATA |
| 1 x M.2(NGFF) | |
| I/O Interface | |
| Display Output | 1 x HDMI 2.0b (up to 4096 x 2160 @60Hz) |
| 1 x Display Port 1.4a (up to 4096 x 2160 @60Hz) | |
| 1 x LVDS Single/Dual channel 18/24-bit (up to 1920 x 1200 @60Hz) (select by switch) | |
| 1 x eDP 4 lane (up to 4096 x 2304 @60Hz) (select by switch) | |
| Ethernet | 2 x LAN : 2.5GbE LAN (Intel® I225-V) |
| Audio | 1 x Line out |
| 1 x Mic | |
| 1 x Front Audio (2x5-pin) | |
| HD Audio : Realtek ALC888S HD audio codec | |
| I/O Interface | 4 x Internal RS-232 (2x5 pin, P=2.0) |
| 1 x Internal RS-422/485 (2x5 pin, P=2.0) (RS-485 support AFC) | |
| 1 x Internal RS-232/422/485 (2x5 pin, P=2.0) (RS-485 support AFC) | |
| 4 x Internal USB 2.0 (2x4 pin, P=2.0) | |
| 1 x PS/2 (1x6 pin) | |
| 1 x DIO : 8-bit digital I/O (2x5 pin) | |
| 4 x External USB 3.2 Gen2x2 | |
| 1 x External USB 4 Gen2x2 | |
| Expansion | 1 x PCIe x8 : Open-ended Slot(with x4 signal) |
| 2 x M.2(NGFF) : 1 x M.2 2230 A key (PCIe x1/USB 2.0), 1 x M.2 2242/2280 M key (PCIe x2/SATA) | |
| Other Features | |
| TPM | 1 x TPM 2.0 connector (2x10 pin) (SPI interface) |
| Power | |
| Input |
9~36V DC input 1 x Internal power connector (2x2 pin) 1 x External DC power Jack (Ø5.5mm) |
| Power Consumption | 12V@6.48A (Intel® Core™ i7-1185G7E up to 4.4GHz CPU with 16GB (8GB x 2) DDR4-3200 memory running in 2.8GHz) |
| Environment | |
| Operating Temperature | -20°C ~ 60°C |
| Storage Temperature | -30°C ~ 70°C |
| Humidity | 5% ~ 95%, non-condensing |
| Certifications | |
| Safety & EMC | CE/FCC compliant |
Ordering Information
| tKINO-ULT6-i7-R10 | Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Core™ i7-1185G7E Proccessor, 9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS |
|---|---|
| tKINO-ULT6-i5-R10 | Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Core™ i5-1145G7E Proccessor, 9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS |
| tKINO-ULT6-i3-R10 | Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Core™ i3-1115G4E Proccessor, 9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS |
| tKINO-ULT6-C-R10 | Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Celeron® 6305E Proccessor, 9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS |
Package Contents
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