COM-HPC Client size C Module, supports LGA1700 Intel® 12th/13th/14th Generation Core™ i9/i7/i5/i3, Pentium® and Celeron® processor, quadruple independent display, Dual 2.5 GbE, PCIe Gen 5, SATAIII, USB 3.2, RoHS

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» Supports LGA1700 Intel® 12th/13th Desktop CPU (TDP up to 65W)
» Dual-channel DDR5 up to 4400MHz
» Support DisplayPort 1.2, HDMI™ & eDP
» Support PCIe Gen5 / Gen4 /Gen3 signals


IEI's COM-HPC Client Size C:
Compact Powerhouse for High-Demand Industrial Applications

As industries demand more computing power in smaller devices, single units are now expected to handle a wide range of tasks comprehensively, even in industrial applications.

IEI introduces the COM-HPC Client Size C module, featuring a 14th Gen Intel® Core™ processor with up to 24 cores, PCIe Gen5 lanes, and quadruple 4K displays. Optimized for demanding applications, it supports AI, industrial automation, and more, ensuring reliability with advanced features.

14th GEN high
performance CPU+GPU

PCIe Gen5
high bandwidth

4 simultaneous

Extensive connectivity
with USB 3.2 GEN2,
MIPI CSI, etc.

Dual Channel DDR5 SODIMM 5600MHz up to 96GB

12 PCIe Expansion:
1 PCIe x16 (Gen5),
4 PCIe x4 (Gen4),
1 PCIe x4 (Gen3),
6 PCIe x1 (Gen3)

Unleashing Power with Intel’s 14th Gen i9

The HUK-CR680 supports the cutting-edge Intel® 14th Generation i9-14900 processor, marking a significant leap forward in computing power and efficiency. This integration signifies up to a 2.23 times performance boost over systems with Intel® 11th Generation processors, showcasing the rapid advancement in processor technology in recent generations.

The Raptor Lake-S Refresh processors benefit from Intel®'s hybrid design, which combines Performance-cores with Efficient-cores. Equipped with these high-performance processors, this system excels in several key domains, including high-performance edge computing, data analytics, artificial intelligence (AI), and machine learning (ML). This hybrid architecture ensures optimal performance and efficiency, making it an ideal choice for demanding applications and workloads.

Processor P-cores/E-cores Max Frequency EUs TDP
Intel® Core™ i9 processor 14900 5.4GHz/4.3GHz 32 65W
Intel® Core™ i7 processor 14700 5.3GHz/4.2GHz 32 65W
Intel® Core™ i5 processor 14400 4.7GHz/3.5GHz 24 65W
Intel® Core™ i3 processor 14100 4.7GHz/n.a. 24 60W

Quad Independent Displays

The HUK-R680, integrated with Intel® UHD graphics 730/770 driven by Xe architecture, supports four independent displays, enabling a multi-monitor setup that enhances productivity and multitasking. With three DDI and one eDP interfaces up to 4kp60 resolution, it allows for flexible video interface design.

3 x DDI Interfaces

1 x eDP Interface

4K Capable

Up To 32EUs

Future-Proof PCIe Gen 5 Expansion

The growth of AI, data centers, and high-performance computing drives the adoption of PCIe 5.0, which offers significantly higher data throughput and transmission speeds. Each new PCIe standard iteration aims to double the transmission speed, enhancing efficiency and capability in managing large data volumes. This trend underscores the continuous push for better performance in data-intensive applications.

Carrier Board Design Service

IEI offers a fast, cost-effective carrier board design service that minimizes time to market. Our experienced R&D teams assist from initial design to prototype testing, offering reference schematics, review services, and simulation for confidence in design functionality. Our Shanghai and Taipei labs provide advanced signal and power sequence verification to ensure reliability and resolve design-application barriers.

COM-HPC: Revolutionizing High-Performance Computing with Enhanced Processing Power, Energy Efficiency, and Connectivity

COM-HPC, short for Computer-on-Module for High-Performance Computing, represents a significant leap forward in terms of processing power, energy efficiency, and connectivity. It promises to supercharge data-intensive applications, enable real-time analytics, and drive innovation across various sectors, including autonomous vehicles, AI-driven solutions, healthcare, and more.

Unleash the Power of Size C COM-HPC Module

Designed for high-performance applications, our Client Type Size C module is the perfect blend of power, scalability, and efficiency.

  • Maximum I/O Density and Performance
  • High-Performance Processors
  • Strong Future Scalability
  • Enhanced Thermal Management
COM-HPC Size Benefits
Mini Smallest size, suitable for ultra-compact systems; minimal power consumption, simple thermal management.
Size A Small size, suitable for space-constrained applications; low power consumption, easy thermal management.
Size B Medium size, provides more I/O interfaces; suitable for embedded and medium-performance applications.
Size C Provides maximum I/O density and performance; supports high-performance processors and more interfaces; strong future scalability.
Size D Larger size, suitable for applications requiring extensive I/O and high bandwidth; supports higher thermal design power.
Size E Largest size, offers the most comprehensive I/O and highest performance; suitable for the most demanding high-performance computing needs.

Enhanced Performance

Handle complex workloads, process large
datasets in real-time, and accelerate

Scalability and Flexibility

Future-proof investments and easily upgrade
computing capabilities without significant
hardware changes

Energy Efficiency

Consuming less power while delivering
high-performance computing capabilities

Robotic Surgery

Rugged Network Communication

Test and Measurement

Real-time collaborative robotics

Hardware Spec.

Form Factor
Form Factor COM-HPC SIZE C
CPU Intel® Alder Lake-S/Raptor Lake-S/Raptor Lake-S Refresh LGA1700 Desktop CPU (TDP up to 65W)
Chipset R680E
Memory 2 x 262pin DDR5 5600 SO-DIMM sockets
Memory Max. up to 96GB
Cooling method / System Fan 1 x CPU FAN connector
Physical Characteristics
Dimensions (LxWxH) (mm) 160 x 120mm
Storage 2 x SATA : signals to the baseboard
I/O Interface
Display Output 4 x Display Port : 3 x DDI and 1 x eDP signals to baseboard
Ethernet 2 x LAN -
1 x PCIe 2.5 GbE with Intel i226-V signal to baseboard
1 x PCIe 2.5 GbE with Intel i226-LM signal to baseboard
Audio 2 x HD Audio -
1 x HD Audio signal to baseboard
1 x Soundwire Audio/I2S Audio signal to baseboard
I/O Interface 8 x Internal USB 2.0 : signals to the baseboard
4 x External USB 3.2 Gen2x1 : signals to the baseboard
2 x UART : signals to the baseboard
Expansion 1 x PCIe x16 : PCIe signals to the baseboard
5 x PCIe x4 : PCIe signals to the baseboard
6 x PCIe x1 : PCIe signals to the baseboard
Power Supply ATX 12V Power Supply
Operating Temperature -10°C ~ 60°C
Storage Temperature -30°C ~ 70°C

Ordering Information

HUK-CR680-R10 COM-HPC Client size C Module,Intel® Alder Lake S support R680E processor, Dual 2.5 GbE, PCIe Gen 5 , SATA 6Gb/s, USB 3.2 gen 2 , RoHS

Package Contents

Package Content
  • 1 x HUK-CR680 single board computer

  • 1 x QIG