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TANK-870e-H110

High-Performance 6th/7th Generation Intel® Core™ Processor

  • Overview
    ● 6th/7th Gen Intel® Core™ processor platform with Intel® H110 chipset and DDR4 memory
    ● Support dual display VGA+HDMI
    ● On-board internal power connector for providing power to add-on cards
    ● Great flexibility for hardware expansion

  • Specifications

    • Hardware Spec.

      Spec Item Description
      Form factor
      SBC Form Factor ●CPU:
      Intel 7th Gen Core CPU &
      Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35W)
      Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)
      ●Chipset: Intel® H110
      ●System Memory:
      2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 32GB)
      ●Power:
      Input - DC Jack: 9 V~36 V DC, Terminal Block: 9 V~36 V DC
      Consumption: 19 V@3.44 A (Intel® Core™ i7-6700TE with 8 GB memory)
      Internal Connector: 5V@3A or 12V@3A
      ●Reliability:
      Operating Shock - Half-sine wave shock 5G, 11ms, 100 shocks per axis
      Non-Operating Shock - Half-sine wave shock 15G, 11ms, 100 shocks per axis
      Operating Vibration - MIL-STD-810G 514.6C-1 (with SSD)
      Non-Operation Vibration - Half-sind mode IEC-60068-2-06
      Safety/EMC - CE/FCC
      I/O Interface
      I/O Ports ●USB: 4 x USB 3.0
      ●Ethernet:
      2 x RJ-45 PCIe GbE by RTL8111G controller
      ●COM Port:
      2 x RS-232/422/485 (DB-9, w/ 2.5kV isolation protection)
      ●Display:
      1 x VGA (Up to 1920 x 1200@60Hz)
      1 x HDMI 1.4 (up to 3840x2160@30Hz)
      ●Audio: 1 x Line-out, 1 x Mic-in
      Expansion Slots
      Expansion Slots ●PCIe Mini:
      1 x Full-size PCIe Mini slot
      1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
      ●Backplane:
      3A: 1 x PCIe x16, 2 x PCI
      3B: 1 x PCIe x16, 1 x PCIe x4, 1 x PCI
      3C: 3 x PCI
      System
      Cooling method / System Fan Fanless
      Drive Bays 1 x 2.5＂ SATA 6Gb/s HDD/SSD bay
      Indicator&Buttons
      Buttons 1 x Power Button
      1 x Reset Button
      1 x AT/ATX Switch
      Physical Characteristics
      Construction Extruded aluminum alloys
      Color
      Color Dark silver purple + Silver
      Dimensions
      Dimensions 132.6 x 255.2 x 190 (WxDxH) (mm)
      Weight
      Weight 4.2 kg/6.3 kg
      Environment
      Operating Temperature i7-6700TE -20°C ~ 50°C with air flow (SSD)
      i5-6500TE -20°C ~ 60°C with air flow (SSD)
      Humidity 10% ~ 95%, non-condensing

    • Ordering Info.

      Item No. Description
      TANK-870e-H110-i5/4G/3A-R10 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
      TANK-870e-H110-i5/4G/3B-R10 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI  expansion, VGA/HDMI, 9~36V DC, RoHS
      TANK-870e-H110-i5/4G/3C-R10 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 3 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
      TANK-870e-H110-i7/4G/3A-R10 Ruggedized Fanless embedded system with Intel® Core  i7-6700TE 2.4GHz, (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
      TANK-870e-H110-i7/4G/3B-R10 Ruggedized Fanless embedded system with Intel® Core  i7-6700TE 2.4GHz, (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
      TANK-870e-H110-i7/4G/3C-R10 Ruggedized Fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 3 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS

    • Package Contents

      • 1 x Chassis Screw

      • 1 x Mounting Bracket