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WAFER-ULT5

3.5” SBC supports Intel® 8th Generation Whiskey Lake processor with DDR4 SO-DIMM, Triple display with dual HDMI 1.4, LVDS, Triple GbE, USB 3.1 Gen2, M.2 A key, mPCIe with mSATA support, SATA 6Gb/s, COM and RoHS

  • Overview
    ● 3.5” SBC supports Intel® 8th generation Whiskey Lake processor with DDR4 SO-DIMMs
    ● Triple display with dual HDMI, LVDS selection
    ● M.2 A Key, PCIe Mini slot with mSATA spport
    ● COM, USB 3.1 Gen2, SATA 6Gb/s support
    ● Support temperature operation: -20°C ~ 60°C

  • Features

    Comparison of Intel® Processor Generation

      Skylake Q3’15 Kaby Lake Q3’16 Whiskey Lake Q2’19
    Graphics HD Graphics 520 HD Graphics 620 UHD Graphics 620

    Since 2015 there are many improvements from Skylake U to Whiskey Lake U, and they upgraded not only CPU but also GPU. The new Gen is equipped with the latest 14nm UHD Graphics engine. It provides a better Ultra HD 4k capability that will not lag or break off.

      Skylake Q3’15 Kaby Lake Q3’16 Whiskey Lake Q2’19
    CPU Core/ Graphics SKL-U  (BGA)
    2+3e, 2+2 , 2+1    		 KBL-U  (BGA)
    2+2 , 2+1    		 WHL-U  (BGA)
    4+2 , 2+2
     PCH-LP 100 Series 22nm 100 Series 22nm 300 Series 14nm
    I/O Connectivity USB 3.2 Gen1 USB 3.2 Gen1 USB 3.2 Gen2
    Memory DDR4/DDR3L DDR4/DDR3L Up to DDR4 2400

    Heat Sink Introduction

     

    Compared with heat sink, the standout of heat spreader is directly transferred the heat from CPU to the opposite direction of back cover. This solution allows products to fit in environment with space limitation and you could also attach the heat sink on the heat spreader as need. And this is the reason our customer wants to have heat spreader instead of heat sink. If you are interested in that info you can find more details in the product user manual 

    Plus if your application is not suitable for heat spreader. Wafer ULT5 also provides our customers with a fanless heat sink module as an option. If those solutions still not good enough and you still want to have a different design. We would defiantly happy to customized a new thermal solution for our customer

    I/O Interface

    Dimensions (Unit: mm)

  • Specifications

    • Hardware Spec.

      Spec Item Description
      System
      CPU8th generation Intel® mobile ULT Processor
      Intel® Core™ i7-8665UE 1.7 GHz (up to 4.4GHz, Quad-core, 8MB cache, TDP=15W)
      Intel® Core™ i5-8365UE 1.6 GHz (up to 4.1GHz, Quad-core, 6MB cache, TDP=15W)
      Intel® Core™ i3-8145UE 2.2 GHz (up to 3.9GHz, Dual-core, 4MB cache, TDP=15W)
      Intel® Celeron® processor 4305UE (up to 2.0GHz, Dual-core, 2MB cache, TDP=15W)
      Intel® Celeron® processor 4205U (up to 1.8GHz, Dual-core, 2MB cache, TDP=15W)
      Memory1 x DDR4 2400MHz SO-DIMM
      Memory Max.32GB
      Physical Characteristics
      Dimensions (LxWxH) (mm)115 X 165
      Net Weight350g
      Storage
      Storage1 x SATA :with 5V SATA power connector
      I/O Interface
      Display Output2 x HDMI :1.4 (up to 4096x2160@30Hz)
      1 x LVDS :18/24-bit dual-channel LVDS by CH7511B DP to LVDS converter (up to 1920x1200@60Hz)
      Ethernet3 x LAN :2 x Intel I211AT (colay with I210);
      1 x PCIe GbE LAN Intel i219 Controller;
      Audio1 x HD Audio :2x5 pin, support 7.1 channel HD audio by AC-KIT-892HD-R10
      I/O Interface1 x Internal RS-232 :1x9 pin, P=1.25
      1 x Internal RS-232/422/485 :1x9 pin, P=1.25 (Support Auto Flow Control over RS-485)
      4 x External USB 3.2 Gen1x1
      2 x Internal USB 2.0 :2x4 pin, P=2.0
      Expansion1 x PCIe mini Card Slot :Full-size (w/ SATA signal, support mSATA)
      1 x M.2(NGFF) :with A Key 2230
      Power
      Power Supply12V DC input
      1 x Internal power connector (2x2 pin)
      Support AT/ATX mode
      Environment
      Operating Temperature-20°C ~ 60°C
      Storage Temperature-30°C ~ 70°C
      Humidity5% ~95%, non-condensing

    • Ordering Info.

      Item No. Description
      WAFER-ULT5-i7-R10 3.5" SBC supports Intel® 14nm 8th Gen (ULT) Core™ i7-8665UE (15W) on-board CPU with DDR4 SO-DIMM , triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA , SATA 6Gb/s, dual COM, support Audio and RoHS
      WAFER-ULT5-i5-R10 3.5" SBC supports Intel® 14nm 8th Gen (ULT) Core™ i5-8365UE (15W) on-board CPU with DDR4 SO-DIMM support, triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA support, SATA 6Gb/s, dual COM, Audio and RoHS
      WAFER-ULT5-i3-R10 3.5" SBC supports Intel® 14nm 8th Gen (ULT) Core™ i3-8145UE (15W) on-board CPU with DDR4 SO-DIMM support, triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA support, SATA 6Gb/s, dual COM, Audio and RoHS
      WAFER-ULT5-CE-R10 3.5" SBC supports Intel® 14nm 8th Gen (ULT) Celeron™4205U (15W) on-board CPU with DDR4 SO-DIMM support, triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA support, SATA 6Gb/s, dual COM, Audio and RoHS
      WAFER-ULT5-C-R10 3.5" SBC supports Intel® 14nm 8th Gen (ULT) Celeron™4305UE (15W) on-board CPU with DDR4 SO-DIMM support, triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA support, SATA 6Gb/s, dual COM, Audio and RoHS

    • Package Contents

      • 1 x WAFER-ULT5 single board computer with Heatspreader

      • 1 x Power Cable

      • 1 x SATA with power cable kit

      • 2 x RS-232 cable

      • 1 x QIG (Quick Installation Guide)