IEI to Showcase NANO-X100 4" SBC with AMD Ryzen™ AI Processor for CASTEC AMR at Advancing AI 2026

NEW TAIPEI CITY, Taiwan, July 24, 2026 —— IEI Integration Corp. today announced that it showcases its NANO-X100 4-inch single board computer at AMD Advancing AI 2026. Powered by the AMD Ryzen™ AI Embedded X100 Series processor, NANO-X100 will be demonstrated in collaboration with CASTEC International Corp. as part of the i-Operator mobile cobot solution, highlighting how compact edge AI computing can engage the low latency AI capability in the mobile robotic applications in semiconductor manufacturing environments.

As semiconductor manufacturing continues to adopt automation, wafer carrier and process carrier handling have become critical to production efficiency and equipment utilization. Modern AMRs must process route planning, robotic arm coordination, sensor data, safety protection, and mission status monitoring in real time. As a result, embedded computing platforms capable of local AI inference and data processing are becoming essential for upgrading AMRs and mobile collaborative robots.

Compact Edge AI Computing Platform for AMR and Industrial Automation

NANO-X100 features a compact 4-inch SBC form factor, making it suitable for AMR, robotic control cabinets, and space-constrained industrial automation equipment. Built on AMD Ryzen™ AI Embedded X100 Series processors, the platform integrates "Zen 5" CPU architecture, RDNA™ 3.5 GPU capability, and XDNA™ 2 NPU AI acceleration to support machine vision, real-time video analytics, AI inference, and industrial automation applications.

NANO-X100 also provides flexible industrial I/O and expansion, including 64GB LP-DDR5 memory, and up to 128GB memory on selected SKUs with multiple display outputs, dual 2.5GbE ethernet, M.2 NVMe storage, USB 3.2, and serial communication interfaces. These features help system integrators consolidate computing, communication, sensing, and control functions on a single compact platform.

"AMRs are no longer just automated vehicles; they are mission-critical AI nodes that require instantaneous data processing at the edge," said Y.T. Lee, Vice President at IEI. "Through this collaboration with CASTEC, IEI demonstrates how the NANO-X100 can bring AMD Ryzen™ AI Embedded X100 Series processing capabilities into semiconductor automation and AMR applications."

Integrating CASTEC i-Operator for Semiconductor Carrier Handling Automation

CASTEC i-Operator integrates a mobile robot platform with a collaborative robotic arm to support loading, unloading, replenishment, and material handling workflows in factory production. In this demonstration, NANO-X100 serves as the intelligent computing core of i-Operator, supporting mobility control, pick-and-place operation, status monitoring, and on-site control workflows. i-Operator can also support handling requirements for Reticle POD, FOUP, FOSB, Magazine, JEDEC Tray, and other semiconductor carriers.

"Our i-Operator is designed to bring unprecedented flexibility and stability to human-machine collaboration in semiconductor fabs," said William Lin, Director at CASTEC. "By integrating IEI's NANO-X100 as the intelligent computing core, i-Operator can identify thousands of distinct objects and respond to on-site anomalies within seconds. This leap in embedded AI processing not only optimizes wafer carrier handling but scales to meet broader smart manufacturing demands."

Advancing Smart Manufacturing and Edge AI with AMD and Ecosystem Partners

This collaboration demonstrates the computing potential of X100 Series processors in embedded AI applications and highlights IEI's ability to turn next-generation processor technology into deployable embedded Edge AI platforms. IEI will continue working with AMD and ecosystem partners to advance smart manufacturing, semiconductor automation, industrial robotics, and edge AI.

For more information, please contact the IEI sales team at Sales Inquiry.