Witness the Excellence of IEI 3.5'' SBC at E&A 2023!
See the WAFER-TGL in action at E&A 2023!
Visit our customer's booth 7D007 at Electronics & Applications 2023 in Utrecht, Netherlands, to explore the WAFER-TGL featuring 11th Gen Intel® Core™ U-series processors.
Engineered with smart manufacturing features and proven durability, it's your go-to solution for space-constrained installations, perfect for AGVs (Automated Guided Vehicles), AMRs (Autonomous Mobile Robots), and small factory cabinets. With complete I/O interfaces, including three 2.5 GbE LAN ports for motion control and IP cameras, an M.2 B-key slot with SIM support for LTE cellular communication, and USB 3.2 Gen 2 and serial ports for seamless sensor integration, it's the future-ready choice.
11th Gen. Intel® Core™ U-series
IEI WAFER-TGL is a 3.5" embedded board equipped with the 11th generation Intel® Core™ U processor supporting up to 4 cores, 8 threads, turbo up-to 4.40 GHz. The Intel® Core™ i7 and i5 processors are integrated with Intel® Iris® Xe 96EU graphics core, delivering high AI inference performance for the SoC. With no graphics card required, it can provide a cost-effective industrial solution featuring low power consumption and effective heat transfer.
Quad Independent Displays with up to 4K Resolution
The WAFER-TGL 3.5" motherboard integrates the latest Intel® Iris® Xe graphics (Gen12), offering max. 96 EUs and up to 2.95 times faster graphics performance to deliver excellent graphics performance. With two HDMI™ 1.4 (up to 4096 x 2160@30Hz), one DP 1.4 (up to 4096 x 2160 @60Hz) and the option to use the iDPM interface to support four independent displays, it is ideal for video surveillance, kiosks, digital signage, or medical imaging application which requires high graphics performance.
Well-design Thermal Solution
IEI has developed a highly efficient thermal solution for the 3.5" motherboard - IEI Heat Conduction Casing (IHCC). The IHCC can effectively improve heat transfer performance, and we will keep on improving our heat sink design to ensure providing an innovative thermal solution for the industrial market.
The IHCC consists of a case and a heat conduction block that is made to perfectly fit with the CPU to achieve heat transfer.
Ready for Any Scenario
The WAFER-TGL supports up to quad independent display, thus it is flexible to use in multi-display applications. Its diverse display outputs offered by the iDPM modules make the WAFER-TGL more suitable for any feasible scenario.