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TANK-870e-H110

High-Performance 6th/7th Generation Intel® Core™ Processor

» 6th/7th Gen Intel® Core™ processor platform with Intel® H110 chipset and DDR4 memory
» Support dual display VGA+HDMI™
» On-board internal power connector for providing power to add-on cards
» Great flexibility for hardware expansion

Specifications

Hardware Spec.

Form factor
SBC Form Factor
  • CPU:
    Intel 7th Gen Core CPU &
    Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)
  • Chipset: Intel® H110
  • System Memory:
    2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 32GB)
  • Power:
    Input - DC Jack: 9 V~36 V DC, Terminal Block: 9 V~36 V DC
    Consumption: 19 V@3.44 A (Intel® Core™ i7-6700TE with 8 GB memory)
    Internal Connector: 5V@3A or 12V@3A
  • Reliability:
    Operating Shock - Half-sine wave shock 5G, 11ms, 100 shocks per axis
    Non-Operating Shock - Half-sine wave shock 15G, 11ms, 100 shocks per axis
    Operating Vibration - MIL-STD-810G 514.6C-1 (with SSD)
    Non-Operation Vibration - Half-sind mode IEC-60068-2-06
    Safety/EMC - CE/FCC
I/O Interface
I/O Ports
  • USB: 4 x USB 3.0
  • Ethernet:
    2 x RJ-45 PCIe GbE by RTL8111G controller
  • COM Port:
    2 x RS-232/422/485 (DB-9, w/ 2.5kV isolation protection)
  • Display:
    1 x VGA (Up to 1920 x 1200@60Hz)
    1 x HDMI™ 1.4 (up to 3840x2160@30Hz)
  • Audio: 1 x Line-out, 1 x Mic-in
Expansion Slots
Expansion Slots
  • PCIe Mini:
    1 x Full-size PCIe Mini slot
    1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
  • Backplane:
    3A: 1 x PCIe x16, 2 x PCI
    3B: 1 x PCIe x16, 1 x PCIe x4, 1 x PCI
System
Cooling method / System Fan Fanless
Drive Bays 2 x 2.5” SATA 6Gb/s HDD/SSD bay

 

Indicator&Buttons
Buttons 1 x Power Button
1 x Reset Button
1 x AT/ATX Switch
Physical Characteristics
Construction Extruded aluminum alloys
Color
Color Dark silver purple + Silver
Dimensions
Dimensions 132.6 x 255.2 x 190 (WxDxH) (mm)
Weight
Weight 4.2 kg/6.3 kg
Environment
Operating Temperature i7-6700TE -20°C ~ 50°C with air flow (SSD)
i5-6500TE -20°C ~ 60°C with air flow (SSD)
Humidity 10% ~ 95%, non-condensing

Ordering Information

TANK-870e-H110-i5/4G/3B-R12 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI expansion, VGA/HDMI, 9~36V DC, Powder paint, RoHS
TANK-870e-H110-i5/4G/3A-R12 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9~36V DC, Powder paint, RoHS

Package Contents

  • 1 x Chassis Screw
  • 1 x Mounting Bracket
Download Specs.

Resources

eCatalog

Embedded System Brochure

2025 Product Selection Guide

2025 Edge Computing Brochure

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