IDEAL SOLUTION FOR EDGE APPLICATION BY WAFER-EHL
The WAFER-EHL 3.5'' SBC supports Intel® Celeron® J6412 on-board SoC. It features reliable performance, advanced network connectivity, rich I/O, low power consumption with well-design thermal solution, and fanless design that fits small chassis size for space-critical installation like AMR (Autonomous Mobile Robot) and small cabinets in factories. The WAFER-EHL is equipped with a PCI Express Gen3 x2 expansion slot, allowing users to take advantage of PCIe cards to expand AIoT application potential. It is an ideal choice for IoT edge applications, such as system control, kiosk, digital signage, electric vehicle charging station and medical imaging.
IMPROVED EFFICIENCY AND PERFORMANCE WITH INTEL® CELERON® J6412 ON-BOARD SOC
IEI WAFER-EHL is a motherboard powered by Intel® Celeron® J6412 on-board SoC, supporting up to 2.6GHz, quad-core, 1.5M cache and TDP 10W. It has a 75% performance gain over the previous generation, up to a 1.7x improvement in single-thread performance and up to a 1.5x improvement in multi-thread performance. The processor of IEI WAFER-EHL builds on new levels of CPU, and graphics performances with integrated IoT features, real-time performance, manageability, security, and functional safety.
PCIE X4 EXPANSION FOR ADDED FUNCTIONALITY
AND FAST APPLICATION DEPLOYMENT
The WAFER-EHL features a PCIe x4 (x2 signal) slot, which is a new design for IEI compact 3.5" single board computer to expand functionality providing easy integration of PoE, video capture or I/O cards with a compatible riser card.
IEI-DEVELOPED RISER CARD WITH ENHANCED STABILITY
Moreover, both of the riser cards can be firmly secured to enhance stability by using the L-shaped bracket, in which screw holes are perfectly matched with those on the side of the heat spreader to make it simple and easy to install.
WELL-DESIGN THERMAL SOLUTION
IEI has developed a highly efficient thermal solution for the 3.5" motherboard - IEI Heat Conduction Casing (IHCC). The IHCC can effectively improve heat transfer performance ,and we will keep on improving our heat sink designs to ensure providing a innovative thermal solution for industrial market.
The IHCC consist of a casing and a heat conduction block that is made to perfectly fit with the CPU to achieve heat transfer.
With its well-design thurmal casing, WAFER-EHL provides complete 13 holes on three sides. It can be installed on a control cabinet's rear panel, door, or onto a DIN rail. And it is easy to install additional thermal module for operating under high ambient temperatures.
A. Embedded System
B. Electrical Cabinet
C. Flexible Thermal Module Stacking
HIGH SPEED TRANSMISSION
SATA 6Gbps Provides Faster Transfer Speeds
Twice as fast data processing it is capable of delivering lightning fast data transfer experience for edge AI data process applications.
Two USB 3.2 Gen 2 (10Gb/s)
Two USB 3.2 Gen 2x1 ports are integrated to support 10 Gb/s data transmission speed, which is 2x faster than its predecessor.
Delivers Dual Low-Latency 2.5G LAN Powered by Intel
2.5 GbE supports various connection speeds between 100 Mbps and 2.5 Gbps on Cat6 and Cat 5e cables, which means user can experience the full capability of high-performance network solutions without significant costs for upgrading cables.
M.2 2230 A Key for Wi-Fi/Bluetooth
The M.2 2230 A key slot carrying with PCIe 3.0 x1 and USB 2.0 signals allows it
to adopt the latest Wi-Fi 6E technology.
Wi-Fi 6E enhances low latency and supports service levels that are equivalent to 5G networks.
M.2 2242/80 M Key for PCIe
The M.2 2242/80 M key slot carrying with PCIe Gen3 x2 and USB 2.0 signals supports up to 16Gbps data-transfer speeds. It's the perfect choice for installing an operating system or application drive to provide fast data access.
• eDP to eDP Connector converter board for IEI iDPM slot
• Dimension (L x W): 40 x 22 (mm)
• Display Output: 1 x eDP
• eDP to LVDS Connector converter board for IEI iDPM slot
• Dimension (L x W): 40 x 30 (mm)
• Display Output: 1 x LVDS
Onboard Intel® Atom™ x6000 series / Pentium® / Celeron® processor (Elkhart Lake platform)
Intel® Celeron® J6412 on-board SoC (up to 2.6GHz, quad-core, 1.5M Cache, TDP=10W)
|Memory||Onboard LPDDR4x 8GB default|
|Memory Max.||up to 16GB|
|Cooling method / System Fan||1 x System fan connector (1x4 pin)|
|Dimensions (LxWxH) (mm)||146mm x 102mm|
|Net Weight||GW: 850g / NW: 350g|
|Storage||1 x SATA : 6Gb/s with 5V SATA power connector|
|1 x M.2(NGFF) : B Key (3042/2242) with PCIe Gen3 x2, support NVME storage|
|Display Output||1 x HDMI™ : up to 3840 x 2160@30Hz|
|1 x Display Port : up to 3840 x 2160@60Hz|
|1 x iDPM : 3040 slot (only for iEi eDP/LVDS/VGA module)|
2 x LAN -
LAN1: Intel® I225V 2.5GbE controller
LAN2: Intel® I225V 2.5GbE controller
|Audio||1 x HD Audio : 1 x iAUDIO, support IEI AC-KIT-888S Audio Module (2 x 5 pin)|
|I/O Interface||2 x Internal RS-232/422/485 : 1x9 pin, P=1.25|
|4 x Internal USB 2.0 : 2x4 pin, P=2.00|
|1 x DIO 12-bit digital I/O (2x7 pin)|
|2 x External USB 3.2 Gen2x1 : 10Gb/s|
|Expansion||1 x PCIe x4 : PCIe Gen3 x2 signal|
2 x M.2(NGFF) -
1 x M.2 A Key for WIFI & BT (2230)(PCIe Gen3 x1/USB 2.0 signal)
1 x M.2 B key (3042/2242) w/ SIM holder (PCIe Gen3 x2/USB 2.0 signal)
|Power Consumption||12V@3.14A (Intel® Celeron® J6412 2.0GHz with on-board 8GB 3200MHz LPDDR4 memory and EUP enabled)|
|Power Supply||+12V DC input power (AT/ATX mode)|
|WAFER-EHL-J6412C-R10||3.5" SBC supports Intel® Celeron® J6412 on-board SoC with 8GB LPDDR4x memory on board default, triple display with DP, HDMI™ and iDPM slot，dual 2.5 GbE, USB 3.2 Gen 2, M.2, SATA 6Gb/s, COM, iAUDIO, 0°C ~60°C and RoHS|
|iDPM-eDP-R10||eDP to eDP Connetor converter board (For iEi Display Module)|
|iDPM-LVDS-R10||eDP to 24 bit dual channel LVDS converter board converter board (For iEi Display Module)|
|NWR-R2S-R10||PCIe x2 to two PCIe x1 riser card for NANO/WAFER on the right side|
|NWR-L2S-R10||PCIe x2 to two PCIe x1 riser card for NANO/WAFER on the left side|
|CM-WAFER-WOF-R10||Cooler Module(W/O FAN);Mechanical;for 3.5” WAFER series；RoHS|
|CM-WAFER-WF-R10||Cooler Module(W/FAN);Mechanical;for 3.5” WAFER series；RoHS|
|CB-USB02A-RS||Dual ports USB cable with bracket, with 2.0mm pitch USB connector;RoHS|
|AC-KIT-888S-R10||Realtek ALC888S 7.1 Channel HD Audio peripheral board,RoHS|
|32102-000100-200-RS||WIRE CABLE;POWER CABLE;SERIAL ATA POWER CABLE;3;150MM;18AWG;(A)MOLEX 8981-4M P=5.08;(B)SATA 15P 180° X2;ONE PCS PKG W/ LABEL;RoHS|
|32005-003500-200-RS||ROUND CABLE;RS-232/422/485;RS-232 CABLE;2;250MM;26AWG;(A)D-SUB 9P MALE+HEXAGONAL SCREW;(B)MOLEX 51021-0900 P=1.25;Wins Precision;RoHS|