WAFER-TGL-U
CPU 11th Gen. Intel® mobile Tiger Lake-UP3 on board processor
Intel® Core™ i7-1185G7E (up to 4.4GHz, quad-core, 12M Cache, TDP=28/15/12W)
Intel® Core™ i5-1145G7E (up to 4.1GHz, quad-core, 8M Cache, TDP=28/15/12W)
Intel® Core™ i3-1115G4E (up to 3.9GHz, dual-core, 6M Cache, TDP=28/15/12W)
Intel® Celeron® 6305 (up to 1.8GHz, dual-core, 4M Cache, TDP=15W)
Memory One 260-pin 3200 MHz DDR4 SO-DIMMs support up to 32 GB
Memory Max. up to 32GB
Ethernet 3 x LAN - LAN1: Intel® I225V 2.5GbE controller LAN2: Intel® I225V 2.5GbE controller LAN3: Intel® I225V 2.5GbE controller
Display Output 2 x HDMI: up to 4096 x 2160@30Hz
1 x Display Port: up to 4096 x 2160@60Hz
1 x iDPM: IEI iDPM 3040 slot (only for IEI eDP/LVDS/VGA module)
Audio 1 x HD Audio: 1 x iAUDIO, support IEI AC-KIT-888S Audio Module (2 x 5 pin)
I/O Interface 1 x Internal RS-232: 2x5 pin, P=2.0
2 x Internal RS-232/422/485: 2x5 pin, P=2.00 ,RS-485 support AFC
2 x Internal USB 2.0: 2x4 pin, P=2.00
1 x DIO: 12-bit digital I/O (2x7 pin, P=2.0)
4 x External USB 3.2 Gen2x1: 10Gb/s
Storage 1 x SATA: 6Gb/s with 5V SATA power connector
Expansion 2 x M.2(NGFF) - 1 x M.2 A key (2230) with PCIe Gen3 x1/USB 2.0 1 x M.2 B Key (2242/3052) for 5G with PCIe Gen3 x2/USB 2.0
Power Supply +12V DC input power (AT/ATX mode)
Operating Temperature 0°C ~ 60°C
Storage Temperature -20°C ~ 70°C
Humidity 5% ~ 95%, non-condensing
Safety & EMC CE/FCC compliant
Cooling method / System Fan 1 x System fan connector (1x4 pin, P=2.54)
TPM Intel® PTT(TPM 2.0)