PCIE-RPL-Q670
CPU	LGA1700 socket supports  12th/13th/14th generation Alder Lake-S Intel® Core™ i9/i7/i5/i3/Pentium®/Celeron® Processor (up to 65W)
Chipset	Intel® Q670E/Q670
Memory	two 288-pin 5200 MHz Dual-Channel DDR5 SDRAM Unbuffered DIMMs
Memory Max.	up to 96GB
Ethernet	2 x LAN - LAN1: Intel® I226-LM 2.5GbE controller LAN2: Intel® I226-V 2.5GbE controller
Display Output	1 x HDMI™: HDMI1.4 4K@30Hz 2 x Display Port - 1 x DP1.4 4K@60Hz, 180° 1 x DP1.4 4K@60Hz, 180°(Option) (The DP interface is not plugged in. If needed, MOQ is 100.)
Audio	HD Audio: 1 x iAUDIO, support IEI AC-KIT-888S Audio Module (2 x 5 pin)
I/O Interface	2 x Internal RS-232: 2x5 pin, P=2.54 2 x Internal RS-232/422/485: 2x5 pin, P=2.54 (RS485 support AFC) 4 x Internal USB 2.0: to backplane 1 x DIO: 12-bit digital I/O (2x7 pin) 2 x External USB 3.2 Gen2x1: 10Gb/s 1 x Internal USB 3.2 Gen2x1: Type A 180° 4 x Internal USB 3.2 Gen1x2: 2 X 10 pin P=2.00 (5Gb/s) 1 x I²C: 1x4 pin
Storage	4 x SATA: 6Gb/s (RAID 0/1/5/10 supported)
Expansion	Description:1 x PCIe Gen3 x16 & 4 x PCIe Gen3 x1 signal via golden finger 4 x PCI signal via golden finger
Power Supply	ATX/AT power supply Support AT/ATX mode ErP/EuP Compliant
Power Consumption	3.3V@2.39A, 5V@9.68A, 12V@6.56A, 5VSB@0.35A (Intel® Core™ i9-12900 CPU with 16 GB 5600 MHz DDR5 memory, EuP mode disabled)
Operating Temperature	-10°C ~ 60°C
Storage Temperature	-30°C ~ 70°C
Humidity	5% ~95%, non-condensing
Dimensions (LxWxH) (mm)	338 mm x 126 mm
Net Weight	GW:1000g / NW:500g
M.2	1 x M.2 M Key (2242/2280, PCIe Gen3 x4 ) NVMe support
Cooling method / System Fan	1 x CPU fan connector (1x4 pin) 1 x System fan connector (1x4 pin)
TPM	Support TPM 2.0 (TPM-IN03 module) & Intel PTT
Form Factor	Full Size Single Board Computer